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Features
This wafer biscuit grinding machine is a kind of supplementary equipment and utilized for waste recycling.
Material: the machine frame is made of steel with international standard, and adopts imported 304 stainless steel plate with thickness of 3mm.Electrical machine (SEW of Germany).
The operation is easy.Firstly,put the wafer waste to the mixing tank until it is full ,close the tank lid,and mix for 30~60 second.Secondly,put off the power ,open the lid if the mixing stops ,and turn the tank for 90 °and take out the wafer power,the power can be resured with cream after sieved by 16~20 mesh screen.The fineness of the final products can be controlled by crushing time.
Advantages
Advantages
1.Smashing Machine is used for collection of wafer bits from the cutting machine.It is a kind of supplementary equipment and utilized for waste recycling.
2.In the wafer line there is wastage from the cutting process which needs to be reused in order to minish the overall wastage of wafer baking system to 2 % .
3.This equipment is used for griding the discarded wafer in to reusable form and the fineness of the final products can be controlled by crushing time.
Technical Data
| Model | LG |
| voltage | 3-phase 380V，50 Hz |
| dimension | 710*760*1270mm |
| weight | 140kg |
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