Features
This is very important equipment in the wafer production line. The wafer baking system uses LPG for heating of the baking plates. It is controlled by a PLC made by SIEMENS brand. The functions of the baking oven are fully automatic from spreading batter on the plates to the procedure of baked wafer sheets coming out of the oven. Baking is even and produces good quality wafer sheets for next procedure. In PLC there is a PID controller which is used to control the temperature of the baking plates automatically .The collection of required signal of PID is supplied by infrared sensor which is produced by RAYTEK of U.S.A .The oven status display and the data reset are supplied by SIEMENS by Japan.
Contactor switch is supplied by SCHENEIDER Company in China. The stepping wheel bearings of the mould rack are SKF Explorer made in France. The pressing roller bearings are SKF Explorer made in Austria. The pneumatic components are supplied by FESTO/SMC. The main drive will be SEW Eurodrive of German brand. There is an automatic spurring-cleaned device at the bottom of the baking oven. There is second pressure relief valve from Madas. The floating system is new type. The pressing system, opening system and tension system are improved about the heat-treatment. The main bolts are screws are 8.8 or 12.6 grade. There is a safety cover for batter inductive switch.
Contactor switch is supplied by SCHENEIDER Company in China. The stepping wheel bearings of the mould rack are SKF Explorer made in France. The pressing roller bearings are SKF Explorer made in Austria. The pneumatic components are supplied by FESTO/SMC. The main drive will be SEW Eurodrive of German brand. There is an automatic spurring-cleaned device at the bottom of the baking oven. There is second pressure relief valve from Madas. The floating system is new type. The pressing system, opening system and tension system are improved about the heat-treatment. The main bolts are screws are 8.8 or 12.6 grade. There is a safety cover for batter inductive switch.
Technical Data
Model | LGDL-39-1 |
heat source | natural gas or liquefied gas |
moulds quantity | 39 |
moulds size | 470*325*35mm |
size of wafer stripe | 3.0*3.0*0.5 |
wafer size | 2.3-2.8mm |
baking time | 95~120 seconds(the thickness of wafer<2.5mm) |
capacity | 1330pieces/h(the thickness of wafer:2.3mm) |
Component materials in contact with food | 304 # stainless steel or cast iron |
Average Power | 5kw |
voltage | 3-phase,380V,50 Hz |
gas consumption | About 21m3/h |
Dimension | 7820*1560*2320mm |
weight | 10100kg |